点胶：作用是将红胶滴到PCB的的固定位置上，主要作用是将元器件固定到PCB上，一般用于PCB两面均有表面贴装元件且有一面进行波峰焊接。
      Dispensing: is the red gum drops to PCB is fixed in position, the main role is to the components are fixed to the PCB, generally used for the PCB surfaces of the surface mount component and a wave soldering.
　   固化：其作用是将贴片胶受热固化，从而使表面贴装元器件与PCB牢固粘接在一起。表面贴装技术含概很多方面，诸如电子元件、集成电路的设计制造技术，电子产品的电路设计技术，自动贴装设备的设计制造技术，装配制造中使用的辅助材料的开发生产技术，电子产品防静电技术等等，因此，一个完整、美观、系统测试性能良好的电子产品的产生会有诸多方面的因素影响。
　　Curing: its role is to heat curing adhesive, so that the surface mount components and PCB adhered together.Surface mount technology covers many aspects, such as electronic components, integrated circuit design and manufacturing technology, electronic products circuit design technology, automatic placement equipment design and manufacturing technology, the assembly manufacturing in the use of auxiliary materials in the development of production technology, electronic products anti-static technology and so on, therefore, a complete, beautiful, system to test the performance of good electronic products generated will be a lot of factors.